CY25814SXCT | Cypress Semiconductor

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CY25814SXCT
Status:生产中

数据手册

(pdf, 286.43 KB) RoHS PB Free

CY25814SXCT

合格汽车
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)32
Input Frequency Min. (MHz)4
Input Signal TypeXtal/Ref-in CMOS
最高工作温度 (°C)70
最高工作电压 (V)3.60
最低工作温度 (°C)0
最低工作电压 (V)2.97
No. of Outputs1
No. of PLL1
Output Frequency Max. (MHz)128
Output Frequency Min. (MHz)16
Output Signal TypeCMOS
Spread Spectrum
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.31 $1.94 $1.73 $1.52 $1.44 $1.34
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

封装材料声明

Last Update: 2017 年 9 月 28 日

IPC 1752 材料成分声明

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

技术文档

产品变更通知 (PCN) (12)

2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2017 年 10 月 25 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
2017 年 10 月 16 日
Shipping Label Upgrade
2017 年 10 月 16 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2017 年 10 月 12 日
Correction to Affected Devices in PCN#071577:Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 12 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2017 年 10 月 12 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2016 年 2 月 08 日
Lead (Pb)- Free Marketing Part Number Definition

Product Information Notice (PIN) (2)

2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels

IBIS (1)

2010 年 8 月 12 日