CY7B994V-2BBXC | Cypress Semiconductor

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CY7B994V-2BBXC
Status:废弃

数据手册

(pdf, 553.78 KB) RoHS PB Free

CY7B994V-2BBXC

合格汽车
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)200
Input Frequency Min. (MHz)24
Input Signal TypeLVTTL, LVPECL
最高工作温度 (°C)70
最高工作电压 (V)3.60
最低工作温度 (°C)0
最低工作电压 (V)3.00
No. of Outputs18
No. of PLL1
Output Frequency Max. (MHz)200
Output Frequency Min. (MHz)24
Output Signal TypeLVTTL
Spread Spectrum
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$53.39 $43.56 $41.03 $38.50 $37.37 $35.97
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
BGA
No. of Pins
100
Package Dimensions
435 L x 1.4 H x 435 W (Mils)
Package Weight
266.60 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
176
Minimum Order Quantity (MOQ)
176
Order Increment
176
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

封装材料声明

RoHS Analysis Certificates (CoA) for Direct Materials

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技术文档

产品变更通知 (PCN) (6)

2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
2017 年 10 月 16 日
Shipping Label Upgrade
2017 年 10 月 15 日
Improve Moisture Sensitivity Level of FBGA Pb-Free Products
2017 年 10 月 13 日
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 100 ball 11x11x1.4mm BGA Packages Using SnAgCu Solder Balls

Product Termination Notice (PTN) (1)

2017 年 11 月 09 日
December 2012 Product Obsolescence Notification

IBIS (1)

2010 年 8 月 12 日