CY7C028V-15AXIT | Cypress Semiconductor

CY7C028V-15AXIT
Status:生产中

数据手册

(pdf, 616.11 KB) RoHS PB Free

CY7C028V-15AXIT

合格汽车
密度 (Kb)1024
频率 (MHz)
最高工作温度 (°C)85
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.60
最低工作温度 (°C)-40
Min. Operating VCCQ (V)3.00
最低工作电压 (V)3.00
组织 (X x Y)64Kb x 16
Part FamilyStand.Async Dual Ports
速率 (ns)15
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$90.09 $76.44 $74.80 $72.62 $71.53 $69.89
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

封装材料声明

IPC 1752 材料成分声明

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

产品变更通知 (PCN) (8)

2017 年 10 月 16 日
Shipping Label Upgrade
2017 年 10 月 15 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2017 年 10 月 12 日
Correction to Affected Devices in PCN#071577:Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 12 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2016 年 2 月 08 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2016 年 2 月 08 日
PCN145326:PCN 125156 Addendum 3:Qualification of Copper Wire Bonds for selectLead Frame (LF) Products
2016 年 2 月 07 日
Q1, 2012 - Q2, 2013 Horizon Report
2012 年 10 月 04 日
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (4)

2016 年 2 月 05 日
Qualification of Kyocera Green Mold Compound:Information-Only Announcement
2016 年 2 月 05 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2016 年 2 月 05 日
Changes to Cypress Address Labels
2016 年 2 月 05 日
Qualification of New Carrier Tape Supplier at Cypress Philippines

IBIS (1)

2011 年 5 月 17 日