CY7C68014A-56PVXC | Cypress Semiconductor

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CY7C68014A-56PVXC
Status:生产中

数据手册

(pdf, 898.01 KB) RoHS PB Free
(pdf, 1.69 MB) RoHS PB Free
(pdf, 5.49 MB) RoHS PB Free

CY7C68014A-56PVXC

Development Kitcy3684
应用USB 高速外设
合格汽车
CPU CoreEnhanced 8051
数据传输批量,中断,同步
I/O 选项8/16 位数据总线,DMA,GPIO,I2C,UART
最高工作温度 (°C)70
最高工作电压 (V)3.60
存储器架构RAM
存储器大小 (KB)16
最低工作温度 (°C)0
最低工作电压 (V)3.00
No. of Endpoints7
I/O 数目24
软件工具Keil S/W Tools (available from Keil)
软件工具Keil S/W Tools (available from Keil)
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.46 $12.55 $11.63 $11.02 $8.87 $8.26
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
56
Package Dimensions
725 L x 0 H x 295 W (Mils)
Package Weight
744.68 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
52
Minimum Order Quantity (MOQ)
52
Order Increment
52
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

封装材料声明

Last Update: 2016 年 11 月 09 日

IPC 1752 材料成分声明

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

技术文档

应用笔记 (18)

产品变更通知 (PCN) (14)

2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 25 日
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2017 年 10 月 24 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
2017 年 10 月 20 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2017 年 10 月 17 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2017 年 10 月 16 日
Shipping Label Upgrade
2017 年 10 月 16 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SSOP Packages.
2017 年 10 月 13 日
Change in Tube Bundling Ship Process
2017 年 10 月 12 日
Correction to Affected Devices in PCN#071577:Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 12 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 12 日
Qualification of KYOCERA Green Mold Compound for Small Shrink Outline Packages (SSOP) assembled at Cypress Manufacturing Limited (CML)

Product Information Notice (PIN) (4)

2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 10 月 25 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound:Information-Only Announcement

代码示例 (1)

2016 年 3 月 29 日

勘误表 (1)

参考设计 (1)

技术文章 (1)