CY8C5866AXI-LP020 | Cypress Semiconductor

You are here

CY8C5866AXI-LP020
Status:生产中

数据手册

(pdf, 6.33 MB) RoHS PB Free
(pdf, 4.28 MB) RoHS PB Free

CY8C5866AXI-LP020

Development KitCY8CKIT-050
合格汽车
Boost Converter (Volts)0.5
CPU CoreARM Cortex-M3
CapSense
专用模数转换器(#_ 最大分辨率 @ 采样速率)DelSig(1, 20 位 @ 180 sps),SAR(1, 12 位 @ 1000 ksps)
专用数模转换器(编号_最大分辨率 @ 采样速率)(4、8-bit @ 8 msps)
EEPROM (KB)2
闪存 (KB)64
LCD 直接驱动(是/否)
最高工作频率 (MHz)67
最高工作温度 (°C)85
最高工作电压 (V)5.50
最低工作温度 (°C)-40
最低工作电压 (V)1.71
No. of CAN Controllers1
No. of DMA Channels24
No. of Dedicated Comparators4
No. of Dedicated Digital Filter Blocks1
No. of Dedicated I2C1
No. of Dedicated OpAmps4
No. of Dedicated SPI0
No. of Dedicated Timer/Counter/PWM Blocks4
No. of Dedicated UART0
GPIO 编号62
可编程模拟模块编号4
可编程通用数字模块编号20
No. of SIO8
No. of USB IO2
SRAM (KB)16
SeriesPSoC 5800
Tape & Reel
USB (Type)全速

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$12.66 $12.12 $11.59 $11.06 $10.53 $9.65
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 58 24-48 hours

Packaging/Ordering

工具包
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

封装材料声明

IPC 1752 材料成分声明

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

应用笔记 (8)

产品变更通知 (PCN) (2)

2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 25 日
Qualification of Manufacturing Changes for PSoC 5LP Products

Product Information Notice (PIN) (3)

2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

边界扫描 BSDL (4)