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APCN173705B | 赛普拉斯半导体


2020 年 4 月 14 日

Ø Issue Date: 2018 年 2 月 7 日

Ø Effectivity Date: 无

Ø Description: Addendum to APCN173705A - Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products