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APCN173705C | 赛普拉斯半导体

APCN173705C

最近更新: 
2020 年 4 月 14 日

Ø Issue Date: 2018 年 5 月 24 日

Ø Effectivity Date: 2018 年 5 月 24 日

Ø Description: Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products