You are here

AN79938 - Design Guidelines for Cypress Ball Grid Array (BGA) Packaged Devices | 赛普拉斯半导体

AN79938 - Design Guidelines for Cypress Ball Grid Array (BGA) Packaged Devices

最近更新: 
2017 年 5 月 4 日
版本: 
*E

AN79938 provides guidelines for designing, manufacturing, and handling Cypress's ball grid array (BGA) packages on printed circuit boards. This application note is for engineers who design and develop surface mount technology (SMT), printed circuit boards (PCB), or flexible printed circuits (FPC) for ball grid array (BGA) packaged devices.

These guidelines document the best practices for PCB/FPC design and assembly when using BGA-packaged devices. Because many factors influence manufacturing, performance, and reliability, validate these guidelines using your own product development and qualification processes. The following are the major influencing factors:

  • PCB/FPC and solder/flux material
  • Manufacturing equipment
  • Application-specific requirements
翻译文档仅作参考之用。我们建议您在参与设计开发时参考文档的英语版本。