AN89611 - PSoC® 3 and PSoC 5LP – Getting Started With Chip Scale Packages (CSP) | 赛普拉斯半导体
AN89611 - PSoC® 3 and PSoC 5LP – Getting Started With Chip Scale Packages (CSP)
This application note provides guidelines for using Cypress PSoC® 3 and PSoC 5LP devices in wafer-level chip scale packages (CSP). Included are instructions for using the I2C bootloader that is factory installed in these devices.
Cypress is now offering its PSoC 3 and PSoC 5LP family of products in wafer-level chip scale packages (WLCSP, or CSP for short). These devices are designed to pack the maximum mixed-signal SoC capability per cubic millimeter. They feature package sizes as small as 4.25 × 4.98 × 0.6 mm to fit into tiny spaces on very small PCBs or flexible printed circuits (FPC). However, their small size mandates special manufacturing techniques and design considerations.