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PCN060958 | 赛普拉斯半导体

PCN060958

最近更新: 
2018 年 5 月 29 日

2M MoBLTM SRAM Process Technology Transition from R52LD-5R (0.25 micron) to R95LD-3R (90-nanometer), Lead-free package on 44 pin TSOP II (Thin Shrunk Outline Package)

Issue Date: 18-Jan-2006
Effectivity Date: 7-Feb-2006