PCN071439 | 赛普拉斯半导体
PCN071439
最近更新:
2018 年 5 月 27 日
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
Issue Date: 28-Mar-07
Effectivity Date: 01-Jun-07