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PCN071516 | 赛普拉斯半导体

PCN071516

最近更新: 
2018 年 5 月 27 日

Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 165BGA 13x15x1.4mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball
Finish

Issue Date: 09-Jun-07
Effectivity Date: 01-Aug-07