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PCN071530 | 赛普拉斯半导体

PCN071530

最近更新: 
2018 年 5 月 28 日

Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls

Issue Date: 20-Jul-07
Effectivity Date: 01-Oct-07