You are here

PCN074591 | 赛普拉斯半导体

PCN074591

最近更新: 
2018 年 5 月 28 日

Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 100 ball 11x11x1.4mm BGA Packages Using SnAgCu Solder Balls

Issue Date: 17-Dec-07
Effectivity Date: 01-Mar-08