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PCN074596 | 赛普拉斯半导体

PCN074596

最近更新: 
2018 年 5 月 28 日

Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
Assembled at AIT

Issue Date: 22-Dec-07
Effectivity Date: 01-Mar-08