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PCN084673 | 赛普拉斯半导体

PCN084673

最近更新: 
2018 年 5 月 28 日

Qualification of KEG6000DA and KEG3000DA Green Mold Compound for 32 leads, Lead-free and standard, 450 mil body size, SOIC Packages Assembled at Cypress

Issue Date: 14-Jun-2008
Effectivity Date: 12-Sep-2008