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PCN104882 | 赛普拉斯半导体

PCN104882

最近更新: 
2018 年 5 月 28 日

Qualification of Carsem Malaysia as an Additional Assembly Site for 32-lead QFN (5X5X0.6 mm) Package Products Using the Saw Singulation Process

Issue Date: 15-Jan-10

Effectivity Date: 15-Apr-10