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PCN171504A | 赛普拉斯半导体

PCN171504A

最近更新: 
2020 年 5 月 6 日

 Ø Issue Date: 2017 年 9 月 7 日

 Ø Effectivity Date: 2017 年 9 月 7 日

Ø Description: Addendum to PCN171504 – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1