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PCN173802 | 赛普拉斯半导体

PCN173802

最近更新: 
2020 年 4 月 14 日

Ø Issue Date: 2017 年 9 月 19 日

Ø Effectivity Date: 2017 年 12 月 19 日

Ø Description: Qualification of G700LS Mold Compound and Roughened NiPdAu Leadframe for Select 8-Lead SOIC Commercial and Industrial Products Assembled at Amkor Philippines 1