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PCN183302 | 赛普拉斯半导体

PCN183302

最近更新: 
2020 年 4 月 14 日

Ø Issue Date: 2018 年 8 月 20 日

Ø Effectivity Date: 2018 年 11 月 20 日

Ø Description: Qualification of Fab 25 as an Additional Wafer Fab Site, EME-G660B Mold Compound and Marketing Part Number Change for Select MCU Automotive Products