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PCN190302 | 赛普拉斯半导体

PCN190302

最近更新: 
2020 年 4 月 14 日

Ø Issue Date: 2019 年 1 月 21 日

Ø Effectivity Date: 2019 年 4 月 21 日

Ø Description: Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH