You are here

PCN201102 | 赛普拉斯半导体

PCN201102

最近更新: 
2020 年 5 月 6 日

Ø Issue Date: 2020 年 3 月 15 日

Ø Effectivity Date: 2020 年 6 月 15 日

Ø Description: Qualification of Die Attach Material and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSET