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32-Lead 400mil TSOP Package, Sumitomo 7351LS Molding Compound, Level 3, Chip Pac, Korea Assembly | 赛普拉斯半导体

32-Lead 400mil TSOP Package, Sumitomo 7351LS Molding Compound, Level 3, Chip Pac, Korea Assembly

最近更新: 
2000 年 10 月 01 日
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