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32-Lead & Below TSOP II (without down bonds), NiPdAu, MSL3, 260C Reflow, OSE-Taiwan Assembly | 赛普拉斯半导体

32-Lead & Below TSOP II (without down bonds), NiPdAu, MSL3, 260C Reflow, OSE-Taiwan Assembly

最近更新: 
2006 年 4 月 18 日
版本: 
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