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48/56-Lead SSOP (300mils) (limited to devices w/o downbonds), NiPdAu, MSL3, 260C Reflow, CML-R Assembly | 赛普拉斯半导体

48/56-Lead SSOP (300mils) (limited to devices w/o downbonds), NiPdAu, MSL3, 260C Reflow, CML-R Assembly

最近更新: 
2006 年 9 月 20 日
版本: 
1