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ALL Thin Small Outlined Package (TSOP I & II), SnPb Lead Finish, MSL3, 235C Reflow, OSE-Taiwan Assembly | 赛普拉斯半导体

ALL Thin Small Outlined Package (TSOP I & II), SnPb Lead Finish, MSL3, 235C Reflow, OSE-Taiwan Assembly

最近更新: 
2006 年 4 月 12 日
版本: 
2