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MSL 1, 235C Reflow, 56-Lead SSOP Package using NITTO MP-8500 Mold Compound and Ni/Leadframe | 赛普拉斯半导体

MSL 1, 235C Reflow, 56-Lead SSOP Package using NITTO MP-8500 Mold Compound and Ni/Leadframe

最近更新: 
2000 年 2 月 01 日
版本: 
1