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Robust System Thermal Management | 赛普拉斯半导体

Robust System Thermal Management

2011 年 4 月 08 日

Today, process technology has advanced to 32nm, resulting in an increase in the number of transistors per unit area and a reduction in package size. At the same time, system designers are trying their best to reduce the system size by increasing the component density on boards, adding as many features in the design as possible to deliver the industries’ best products in terms of space and size.