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Too Much Heat? Implement Thermal Management | 赛普拉斯半导体

Too Much Heat? Implement Thermal Management

最近更新: 
2008 年 11 月 13 日

Thermal management becomes crucial with higher density boards, reduced package sizes, and increased operating frequencies. The more power a device consumes, the more heat it generates. Here's how to dissipate the heat to maintain operating temperatures within specification.  As package sizes continue to shrink and system complexity continues to increase with greater number of devices on the system, thermal management becomes a crucial concern for a system designer.  The number of devices in the system along with the higher frequencies, results in substantial heat generation. Higher power consumption results in higher heat generation, which must be dissipated to maintain operating temperatures within specifications. The steps taken by the system designer for proper management of heat on the system is commonly referred to as thermal management. Proper thermal management improves product performance, reliability, and life expectancy of the devices. 

To read more on this topic, view the full article on CommsDesign.com