BCM20713A1KUFBXG | 赛普拉斯半导体

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BCM20713A1KUFBXG
Status: NRND: 联系销售人员

数据手册

(pdf, 560.24 KB) RoHS PB Free

BCM20713A1KUFBXG

Automotive GradeAutomotive Grade 3
合格汽车
Bluetooth Power ClassClass 1, Class 2, Class 3
Bluetooth SpecificationBluetooth 4.0
CPU CoreARM7TDMI-S
Co-existence InterfaceLegacy SECI
Device TypeSilicon
FM Transceiver (TX/RX)
InterfacesUART,I2C,SPI, I2S/PCM
最高工作频率 (MHz)48
最高工作温度 (°C)85
最高工作电压 (V)3.60
最低工作温度 (°C)-30
最低工作电压 (V)1.40
GPIO 编号8
Partner Modules
Product FamilyBCM20713
RAM (KB)112
Silicon FeaturesIntegrated Regulator, HCI-over-UART/SPI
Tape & Reel
Wireless TechnologyBluetooth (BR + EDR)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
联系销售人员
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
50
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
3430
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
ECCN Suball
5A992.C

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

技术文档

应用笔记 (7)

产品变更通知 (PCN) (2)

2017 年 10 月 11 日
Transition from Broadcom Marketing Part Numbers to Cypress Marketing Part Numbers
2017 年 10 月 11 日
Qualification of STATS ChipPAC Jiangyin (JSCC) as an Additional Assembly Site for Select BGA Products

Product Information Notice (PIN) (4)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Wireless Products Failure Analysis Policy Change
2020 年 3 月 25 日
Acquisition of Broadcom's Internet of Things Business