CY14B104K-ZS25XIT | 赛普拉斯半导体

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CY14B104K-ZS25XIT
Status: 生产中

数据手册

(pdf, 1.03 MB) RoHS PB Free
(pdf, 134.71 KB) RoHS PB Free

CY14B104K-ZS25XIT

Alarms
合格汽车
密度 (Kb)4096
频率 (MHz)
接口Parallel
最高工作温度 (°C)85
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.60
最低工作温度 (°C)-40
最低工作电压 (V)2.70
组织 (X x Y)512Kb x 8
Part Family并行 nvSRAM
RTC
速率 (ns)25
Tape & Reel
温度分类工业
看门狗定时器

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$34.48 $30.59 $28.74 $26.88 $25.40 $23.73
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

技术文档

应用笔记 (10)

产品变更通知 (PCN) (9)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2020 年 5 月 6 日
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (1)

2020 年 8 月 23 日
Q32020 Horizon Report Update

Product Information Notice (PIN) (7)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Verilog (1)

2011 年 3 月 14 日

VHDL (1)

2010 年 4 月 19 日

IBIS (1)

2009 年 11 月 26 日