CY14B104K-ZS45XI | 赛普拉斯半导体
CY14B104K-ZS45XI
| Alarms | 是 |
| 合格汽车 | 否 |
| 密度 (Kb) | 4096 |
| 频率 (MHz) | 无 |
| 接口 | Parallel |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 最高工作电压 (V) | 3.60 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 2.70 |
| 组织 (X x Y) | 512Kb x 8 |
| Part Family | 并行 nvSRAM |
| RTC | 是 |
| 速率 (ns) | 45 |
| Tape & Reel | 否 |
| 温度分类 | 工业 |
| 看门狗定时器 | 是 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $32.23 | $28.59 | $26.86 | $25.13 | $23.74 | $22.18 |
Packaging/Ordering
工具包
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1350
Minimum Order Quantity (MOQ)
135
Order Increment
135
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 2 月 07 日
技术文档
应用笔记 (10)
2018 年 2 月 18 日
产品变更通知 (PCN) (10)
2020 年 12 月 20 日
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select 44-Lead TSOP II Package
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2020 年 5 月 6 日
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (5)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
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