CY14B104LA-BA25XIT | 赛普拉斯半导体
CY14B104LA-BA25XIT
合格汽车 | 否 |
密度 (Kb) | 4096 |
频率 (MHz) | 无 |
接口 | Parallel |
最高工作温度 (°C) | 85 |
Max. Operating VCCQ (V) | 3.60 |
最高工作电压 (V) | 3.60 |
最低工作温度 (°C) | -40 |
最低工作电压 (V) | 2.70 |
组织 (X x Y) | 512Kb x 8 |
Part Family | 并行 nvSRAM |
速率 (ns) | 25 |
Tape & Reel | 是 |
温度分类 | 工业 |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$30.93 | $27.44 | $25.78 | $24.11 | $22.78 | $21.29 |
Packaging/Ordering
工具包
No. of Pins
48
Package Dimensions
393 L x 1.2 H x 236 W (Mils)
Package Weight
119.15 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
147
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
是
无铅
是
Lead/Ball Finish
Sn/Ag/Cu
Marking
技术文档
应用笔记 (10)
2018 年 2 月 18 日
产品变更通知 (PCN) (9)
2020 年 5 月 7 日
Qualification of BKK as an additional assembly site for select 48 & 121 ball grid array (BGA)
2020 年 5 月 6 日
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018 年 5 月 29 日
Qualification of Cypress Philippines as an Additional Assembly Site for select 48BGA products
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 24 日
Qualification of New Die Attach Epoxy and New Substrate Design for Select 48 Ball Grid Array (BGA) Packages
Product Information Notice (PIN) (6)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families