CY14B108K-ZS25XIT | 赛普拉斯半导体
CY14B108K-ZS25XIT
| Alarms | 是 |
| 合格汽车 | 否 |
| 密度 (Kb) | 8192 |
| 频率 (MHz) | 无 |
| 接口 | Parallel |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 最高工作电压 (V) | 3.60 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 2.70 |
| 组织 (X x Y) | 1Mb x 8 |
| Part Family | 并行 nvSRAM |
| RTC | 是 |
| 速率 (ns) | 25 |
| Tape & Reel | 是 |
| 温度分类 | 工业 |
| 看门狗定时器 | 是 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $63.97 | $56.74 | $53.30 | $49.87 | $47.11 | $44.02 |
Packaging/Ordering
工具包
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 2 月 07 日
技术文档
应用笔记 (10)
2018 年 2 月 18 日
产品变更通知 (PCN) (11)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2020 年 5 月 6 日
Qualification of Die Attach Material and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSET
2020 年 5 月 6 日
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
2020 年 4 月 14 日
Addendum to PCN192401 - Qualification of Nitto EM-760 Die Attach Film and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSE-Taiwan
2020 年 4 月 14 日
Qualification of Nitto EM-760 Die Attach Film and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSE-Taiwan
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (7)
2020 年 4 月 14 日
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (7)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
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