CY14B256LA-SP25XIT | 赛普拉斯半导体

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CY14B256LA-SP25XIT
Status: 生产中

数据手册

(pdf, 889.17 KB) RoHS PB Free
(pdf, 716.35 KB) RoHS PB Free
(pdf, 1.01 MB) RoHS PB Free

CY14B256LA-SP25XIT

合格汽车
密度 (Kb)256
频率 (MHz)
接口Parallel
最高工作温度 (°C)85
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.60
最低工作温度 (°C)-40
最低工作电压 (V)2.70
组织 (X x Y)32Kb x 8
Part Family并行 nvSRAM
速率 (ns)25
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$16.29 $14.45 $13.58 $12.70 $12.00 $11.21
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
48
Package Dimensions
625 L x 2.3 H x 295 W (Mils)
Package Weight
650.23 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
133
HTS Code
8542.32.0041
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

技术文档

应用笔记 (10)

产品变更通知 (PCN) (9)

2020 年 11 月 11 日
Transfer of Assembly Operations to Greatek Electronics Inc. for Select 48-Lead SSOP Package
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2020 年 4 月 14 日
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for 3V/5V 1Mb Parallel nvSRAM Products
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Verilog (1)

2011 年 3 月 14 日

VHDL (1)

2009 年 12 月 02 日

IBIS (1)

2009 年 11 月 26 日