CY14E256LA-SZ45XIT | 赛普拉斯半导体

You are here

CY14E256LA-SZ45XIT
Status: 生产中

数据手册

(pdf, 871.74 KB) RoHS PB Free
(pdf, 652.55 KB) RoHS PB Free
(pdf, 713.93 KB) RoHS PB Free

CY14E256LA-SZ45XIT

合格汽车
密度 (Kb)256
频率 (MHz)
接口Parallel
最高工作温度 (°C)85
Max. Operating VCCQ (V)5.50
最高工作电压 (V)5.50
最低工作温度 (°C)-40
最低工作电压 (V)4.50
组织 (X x Y)32Kb x 8
Part Family并行 nvSRAM
速率 (ns)45
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$20.48 $18.17 $17.07 $15.96 $15.08 $14.09
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
32
Package Dimensions
816 L x 95 H x 300 W (Mils)
Package Weight
855.99 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn

技术文档

应用笔记 (10)

产品变更通知 (PCN) (5)

2020 年 4 月 14 日
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for 3V/5V 1Mb Parallel nvSRAM Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 11 日
Transfer of Assembly Site from Amkor Philippines to UTL Thailand for 32-Lead SOIC Product

Product Information Notice (PIN) (7)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 5 月 7 日
Qualification of UTL as an additional finish site for 14-lead DFN and 32-lead SOIC packages
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Verilog (1)

2011 年 3 月 14 日

VHDL (1)

2009 年 12 月 02 日

IBIS (1)

2009 年 11 月 26 日