CY22150FZXC | Cypress Semiconductor

You are here

CY22150FZXC
Status: 生产中

数据手册

(pdf, 546.9 KB) RoHS PB Free

CY22150FZXC

合格汽车
Core Voltage (V)3.3
I/O Voltage (V)2.5/3.3
Input Frequency Max. (MHz)133
Input Frequency Min. (MHz)1
Input Signal TypeXtal/LVCMOS/LVTTL
最高工作温度 (°C)70
最高工作电压 (V)3.45
最低工作温度 (°C)0
最低工作电压 (V)3.13
No. of Outputs6
No. of PLL1
Output Frequency Max. (MHz)200
Output Frequency Min. (MHz)0.08
Output Signal TypeCMOS
Spread Spectrum
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
联系销售人员
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

工具包
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
480
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

封装材料声明

IPC 1752 材料成分声明

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

开发套件/板 (1)

软件与驱动程序 (1)

2011 年 2 月 11 日

产品变更通知 (PCN) (14)

2019 年 6 月 19 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Conversion of Lead-Free Lead Finish in OSE Taiwan Assembly
2018 年 5 月 27 日
Change in Tube Bundling Ship Process
2018 年 5 月 27 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
2018 年 5 月 27 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (2)

2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

IBIS (1)

2010 年 1 月 08 日