CY22393FXC | 赛普拉斯半导体
CY22393FXC
| 合格汽车 | 否 |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 3.3 |
| Input Frequency Max. (MHz) | 166 |
| Input Frequency Min. (MHz) | 1 |
| Input Signal Type | Xtal/Ref-in CMOS |
| 最高工作温度 (°C) | 70 |
| 最高工作电压 (V) | 3.45 |
| 最低工作温度 (°C) | 0 |
| 最低工作电压 (V) | 3.13 |
| No. of Outputs | 6 |
| No. of PLL | 3 |
| Output Frequency Max. (MHz) | 200 |
| Output Frequency Min. (MHz) | 0 |
| Output Signal Type | CMOS |
| Spread Spectrum | 否 |
| Tape & Reel | 否 |
| 温度分类 | 商用 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $16.32 | $13.73 | $12.24 | $10.76 | $10.17 | $9.50 |
Packaging/Ordering
工具包
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
960
Order Increment
960
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Ni/Pd/Au
Marking
封装材料声明
Last Update: 2016 年 11 月 21 日
IPC 1752 材料成分声明
Last Update: 2020 年 2 月 05 日
Last Update: 2020 年 2 月 05 日
技术文档
产品变更通知 (PCN) (15)
2021 年 1 月 11 日
Qualification of Greatek Electronics Inc. as an Alternate Assembly Site for Select 16-Lead TSSOP Package
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 29 日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the CY2238x/ CY2239x, 3-PLL Clock Synthesizers
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 27 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
2018 年 5 月 27 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (4)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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