CY2309CSXI-1 | 赛普拉斯半导体

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CY2309CSXI-1
Status: 废弃

数据手册

(pdf, 581.45 KB) RoHS PB Free

CY2309CSXI-1

合格汽车
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)133
Input Frequency Min. (MHz)10
Input Signal TypeLVCMOS/LVTTL
最高工作温度 (°C)85
最高工作电压 (V)3.60
最低工作温度 (°C)-40
最低工作电压 (V)3.00
No. of Outputs9
No. of PLL1
Output Frequency Max. (MHz)133
Output Frequency Min. (MHz)10
Output Signal TypeLVCMOS
Spread Spectrum
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$9.02 $7.59 $6.77 $5.95 $5.62 $5.25
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1440
Minimum Order Quantity (MOQ)
240
Order Increment
240
Estimated Lead Time (days)
728
HTS Code
8542.39.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

技术文档

产品变更通知 (PCN) (15)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 27 日
Change in Tube Bundling Ship Process
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018 年 5 月 27 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
2017 年 10 月 13 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 8, 14 and 16 lead 150 mils SOIC Pb-free packages assembled at Orient Semiconductor Electronics, Tai

Advanced Product Change Notice (APCN) (6)

2020 年 4 月 14 日
Q419 Horizon Report Update
2020 年 4 月 14 日
Q419 Automotive Horizon Report Update
2020 年 4 月 14 日
Q319 Horizon Report Update
2020 年 4 月 14 日
Q319 Automotive Horizon Report Update
2020 年 4 月 14 日
2019 Horizon Report: Q2 Update
2020 年 4 月 14 日
2019 Automotive Horizon Report: Q2 Update

Product Information Notice (PIN) (1)

2017 年 11 月 06 日
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

2020 年 4 月 14 日
April 2019 Product Obsolescence Notification

IBIS (2)

2010 年 8 月 05 日
2010 年 6 月 10 日