CY2309SXC-1H | 赛普拉斯半导体
CY2309SXC-1H
| 合格汽车 | 否 |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 3.3 |
| Input Frequency Max. (MHz) | 133 |
| Input Frequency Min. (MHz) | 10 |
| Input Signal Type | LVCMOS/LVTTL |
| 最高工作温度 (°C) | 70 |
| 最高工作电压 (V) | 3.60 |
| 最低工作温度 (°C) | 0 |
| 最低工作电压 (V) | 3.00 |
| No. of Outputs | 9 |
| No. of PLL | 1 |
| Output Frequency Max. (MHz) | 133 |
| Output Frequency Min. (MHz) | 10 |
| Output Signal Type | LVCMOS |
| Spread Spectrum | 否 |
| Tape & Reel | 否 |
| 温度分类 | 商用 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $5.46 | $4.59 | $4.09 | $3.60 | $3.40 | $3.17 |
Packaging/Ordering
工具包
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1440
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
140
HTS Code
8542.39.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 2 月 07 日
Last Update: 2020 年 2 月 06 日
技术文档
产品变更通知 (PCN) (17)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Datasheet changes to the method of specification of IDDS and Duty Cycle in the Cypress Zero Delay Buffer (ZDB) products, CY2304, CY2305, CY2309 and CY2308
2018 年 5 月 28 日
Qualification of TSMC as an alternate wafer fabrication site for the Zero Delay Buffer General Purpose Clocks Family
2018 年 5 月 27 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 13 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 8, 14 and 16 lead 150 mils SOIC Pb-free packages assembled at Orient Semiconductor Electronics, Tai
Advanced Product Change Notice (APCN) (1)
2018 年 5 月 27 日
Advance Notification - Transfer of Specific GP Clock Product Manufactured by Cypress Semiconductor Texas to Taiwan Semiconductor
Product Information Notice (PIN) (3)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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