CY23FP12OXI | 赛普拉斯半导体

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CY23FP12OXI
Status: 废弃

数据手册

(pdf, 450.4 KB) RoHS PB Free

CY23FP12OXI

合格汽车
Core Voltage (V)3.3
I/O Voltage (V)2.5/3.3
Input Frequency Max. (MHz)200
Input Frequency Min. (MHz)10
Input Signal TypeLVCMOS/LVTTL
最高工作温度 (°C)85
最高工作电压 (V)3.45
最低工作温度 (°C)-40
最低工作电压 (V)3.13
No. of Outputs12
No. of PLL1
Output Frequency Max. (MHz)200
Output Frequency Min. (MHz)10
Output Signal TypeLVCMOS
Spread Spectrum
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$22.80 $18.81 $17.44 $15.96 $15.28 $14.59
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2350
Minimum Order Quantity (MOQ)
94
Order Increment
94
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

技术文档

开发套件/板 (1)

软件和驱动程序 (1)

2011 年 2 月 11 日

产品变更通知 (PCN) (11)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 27 日
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
2018 年 5 月 27 日
Change in Tube Bundling Ship Process
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
2016 年 2 月 08 日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the FailSafe Clock Product Family

Advanced Product Change Notice (APCN) (1)

2018 年 5 月 27 日
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Grace Semiconductor

Product Information Notice (PIN) (3)

2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

Product Termination Notice (PTN) (2)

2020 年 4 月 23 日
October 2018 Product Obsolescence Notification
2020 年 4 月 14 日
Addendum to PTN183805 - October 2018 Product Obsolescence Notification

IBIS (1)

2010 年 1 月 06 日