CY23FS08OXI | 赛普拉斯半导体
CY23FS08OXI
| 合格汽车 | 否 |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 2.5/3.3 |
| Input Frequency Max. (MHz) | 166.67 |
| Input Frequency Min. (MHz) | 1.04 |
| Input Signal Type | Xtal/LVCMOS/LVTTL |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 3.45 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 3.13 |
| No. of Outputs | 8 |
| No. of PLL | 1 |
| Output Frequency Max. (MHz) | 166.67 |
| Output Frequency Min. (MHz) | 1.7 |
| Output Signal Type | LVCMOS |
| Spread Spectrum | 否 |
| Tape & Reel | 否 |
| 温度分类 | 工业 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $33.00 | $27.23 | $25.25 | $23.10 | $22.11 | $21.12 |
Packaging/Ordering
工具包
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2350
Minimum Order Quantity (MOQ)
94
Order Increment
94
Estimated Lead Time (days)
728
HTS Code
8542.31.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
是
无铅
是
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 4 月 30 日
Last Update: 2020 年 2 月 07 日
Last Update: 2020 年 2 月 05 日
Last Update: 2020 年 2 月 05 日
技术文档
产品变更通知 (PCN) (12)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
2018 年 5 月 27 日
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2016 年 2 月 08 日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the FailSafe Clock Product Family
Advanced Product Change Notice (APCN) (1)
2018 年 5 月 27 日
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Grace Semiconductor
Product Information Notice (PIN) (2)
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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