CY25100SXCF | 赛普拉斯半导体

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CY25100SXCF
Status: 生产中

数据手册

(pdf, 630.03 KB) RoHS PB Free

CY25100SXCF

Development KitCY3672
合格汽车
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)166
Input Frequency Min. (MHz)8
Input Signal TypeXtal/Ref-in CMOS
最高工作温度 (°C)70
最高工作电压 (V)3.45
最低工作温度 (°C)0
最低工作电压 (V)3.13
No. of Outputs2
No. of PLL1
Output Frequency Max. (MHz)200
Output Frequency Min. (MHz)3
Output Signal TypeCMOS
Spread Spectrum
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.55 $11.40 $10.16 $8.93 $8.44 $7.88
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 250 24-48 hours

Packaging/Ordering

工具包
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
485
Minimum Order Quantity (MOQ)
485
Order Increment
485
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2016 年 9 月 15 日

技术文档

开发套件/板 (1)

产品变更通知 (PCN) (15)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 06 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the Spread Spectrum Clock Generators
2018 年 5 月 27 日
Change in Tube Bundling Ship Process
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018 年 5 月 27 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (4)

2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

IBIS (2)

2010 年 4 月 13 日
2010 年 3 月 02 日