CY25422FSXI | 赛普拉斯半导体

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CY25422FSXI
Status: 废弃

数据手册

(pdf, 293.87 KB) RoHS PB Free

CY25422FSXI

合格汽车
Core Voltage (V)1.8
I/O Voltage (V)1.8
Input Frequency Max. (MHz)166
Input Frequency Min. (MHz)8
Input Signal TypeXtal/Ref-in CMOS
最高工作温度 (°C)85
最高工作电压 (V)1.95
最低工作温度 (°C)-40
最低工作电压 (V)1.65
No. of Outputs3
No. of PLL2
Output Frequency Max. (MHz)166
Output Frequency Min. (MHz)3
Output Signal TypeCMOS
Spread Spectrum
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$14.30 $12.03 $10.73 $9.43 $8.91 $8.32
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2910
Minimum Order Quantity (MOQ)
194
Order Increment
194
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

技术文档

产品变更通知 (PCN) (8)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (6)

2020 年 4 月 14 日
Q419 Horizon Report Update
2020 年 4 月 14 日
Q419 Automotive Horizon Report Update
2020 年 4 月 14 日
Q319 Horizon Report Update
2020 年 4 月 14 日
Q319 Automotive Horizon Report Update
2020 年 4 月 14 日
2019 Horizon Report: Q2 Update
2020 年 4 月 14 日
2019 Automotive Horizon Report: Q2 Update

Product Information Notice (PIN) (2)

2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

2020 年 4 月 14 日
April 2019 Product Obsolescence Notification

IBIS (1)

2012 年 4 月 03 日