CY2DP814ZXC | 赛普拉斯半导体

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CY2DP814ZXC
Status: 废弃

CY2DP814ZXC

合格汽车
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)450
Input Frequency Min. (MHz)0
Input Signal TypeLVDS/LVPECL/LVTTL
最高工作温度 (°C)70
最高工作电压 (V)3.45
最低工作温度 (°C)0
最低工作电压 (V)3.13
No. of Outputs4
No. of PLL0
Output Frequency Max. (MHz)450
Output Frequency Min. (MHz)0
Output Signal TypeLVPECL
Spread Spectrum
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.71 $5.64 $5.03 $4.42 $4.18 $3.90
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
192
Minimum Order Quantity (MOQ)
192
Order Increment
192
Estimated Lead Time (days)
91
HTS Code
8542.39.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

封装材料声明

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2016 年 9 月 15 日

技术文档

产品变更通知 (PCN) (13)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 27 日
Change in Tube Bundling Ship Process
2018 年 5 月 27 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
2017 年 10 月 20 日
Qualification of Chipmos, Taiwan as an additional Test site for 44 pin TSOP II Package for selected automotive grade SRAMs

Product Information Notice (PIN) (1)

2017 年 11 月 06 日
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

2017 年 11 月 10 日
July 2014 Product Obsolescence Notification

IBIS (2)

2011 年 2 月 11 日
2011 年 2 月 11 日