CY62126EV30LL-45BVXI | 赛普拉斯半导体
CY62126EV30LL-45BVXI
| 合格汽车 | 否 |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 3.60 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 2.20 |
| Part Family | Async Micropower (MoBL) SRAMs |
| Tape & Reel | 否 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.64 | $2.22 | $1.98 | $1.74 | $1.64 | $1.54 |
Packaging/Ordering
工具包
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
49
HTS Code
8542.32.0041
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Sn/Ag/Cu
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 6 月 03 日
Last Update: 2018 年 6 月 26 日
技术文档
应用笔记 (2)
产品变更通知 (PCN) (10)
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018 年 5 月 28 日
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Qualification of Cypress Philippines as an Additional Assembly Site for select 48BGA products
2018 年 5 月 28 日
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Product Information Notice (PIN) (3)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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