CY62128ELL-45SXA | 赛普拉斯半导体

CY62128ELL-45SXA
Status: 生产中

数据手册

(pdf, 907.93 KB) RoHS PB Free

CY62128ELL-45SXA

Development Kit
合格汽车
密度 (Kb)1024
频率 (MHz)
最高工作温度 (°C)85
Max. Operating VCCQ (V)5.50
最高工作电压 (V)5.50
最低工作温度 (°C)-40
最低工作电压 (V)4.50
组织 (X x Y)128K x 8
速率 (ns)45
Tape & Reel
温度分类Automotive(A)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.20 $5.22 $4.65 $4.09 $3.86 $3.61
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

工具包
SOP
No. of Pins
32
Package Dimensions
810 L x 0 H x 450 W (Mils)
Package Weight
1 340.00 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
500
Minimum Order Quantity (MOQ)
250
Order Increment
250
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

技术文档

应用笔记 (2)

产品变更通知 (PCN) (8)

2020 年 9 月 20 日
Addendum to PCN203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020 年 7 月 29 日
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 5 月 8 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products.
2020 年 4 月 14 日
Qualification of OSE-T as an Additional Assembly Site for Select Automotive Products
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML

Advanced Product Change Notice (APCN) (4)

2020 年 4 月 22 日
Q220 Automotive Horizon Report Update
2020 年 4 月 14 日
Planned Qualification of New Assembly Sites for Select Automotive RAM Products
2020 年 4 月 14 日
2020 Annual Automotive Horizon Update
2020 年 4 月 14 日
Q419 Automotive Horizon Report Update

Product Information Notice (PIN) (3)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Changes to Cypress Address Labels

白皮书 (1)

2016 年 4 月 12 日

IBIS (1)

2009 年 9 月 02 日

VHDL (1)

2009 年 9 月 02 日