CY62128ELL-45ZAXI | 赛普拉斯半导体
CY62128ELL-45ZAXI
| 合格汽车 | 否 |
| 密度 (Kb) | 1024 |
| 频率 (MHz) | 无 |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 5.50 |
| 最高工作电压 (V) | 5.50 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 4.50 |
| 组织 (X x Y) | 128K x 8 |
| Part Family | Async Micropower (MoBL) SRAMs |
| 速率 (ns) | 45 |
| Tape & Reel | 否 |
| 温度分类 | 工业 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.65 | $3.07 | $2.74 | $2.41 | $2.27 | $2.12 |
Packaging/Ordering
工具包
No. of Pins
32
Package Dimensions
460 L x 1 H x 315 W (Mils)
Package Weight
246.64 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2340
Minimum Order Quantity (MOQ)
468
Order Increment
468
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 11 月 05 日
Last Update: 2020 年 5 月 19 日
Last Update: 2018 年 5 月 18 日
技术文档
应用笔记 (2)
产品变更通知 (PCN) (10)
2021 年 2 月 14 日
Transfer of Assembly Operations to Greatek Electronics Inc. for Select 32-Lead TSOP I Package Memory Products
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 24 日
Addendum to PCN 115091-TSOP 8 X 13.4 Tray Modification (Bottom Pocket Fence)
Advanced Product Change Notice (APCN) (4)
2020 年 4 月 14 日
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (5)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
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