CY62128ELL-45ZXI | 赛普拉斯半导体

CY62128ELL-45ZXI
Status: 生产中

数据手册

(pdf, 907.93 KB) RoHS PB Free

CY62128ELL-45ZXI

合格汽车
密度 (Kb)1024
频率 (MHz)
最高工作温度 (°C)85
Max. Operating VCCQ (V)5.50
最高工作电压 (V)5.50
最低工作温度 (°C)-40
最低工作电压 (V)4.50
组织 (X x Y)128K x 8
Part FamilyAsync Micropower (MoBL) SRAMs
速率 (ns)45
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.48 $2.09 $1.86 $1.63 $1.54 $1.44
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
32
Package Dimensions
315 L x 1 H x 787 W (Mils)
Package Weight
375.63 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1560
Minimum Order Quantity (MOQ)
312
Order Increment
312
Estimated Lead Time (days)
49
HTS Code
8542.32.0041
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

技术文档

应用笔记 (2)

产品变更通知 (PCN) (10)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 32 lead TSOP 8x20mm Pb-Free package
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
TSOP Tray Modification (Bottom Pocket Fence)
2018 年 5 月 28 日
Correction to PCN#071512: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (4)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
Changes to Cypress Address Labels

白皮书 (1)

2016 年 4 月 12 日

IBIS (1)

2009 年 9 月 02 日

VHDL (1)

2009 年 9 月 02 日