CY62128ELL-45ZXIT | 赛普拉斯半导体

You are here

CY62128ELL-45ZXIT
Status: 生产中

数据手册

(pdf, 907.93 KB) RoHS PB Free

CY62128ELL-45ZXIT

合格汽车
密度 (Kb)1024
频率 (MHz)
最高工作温度 (°C)85
Max. Operating VCCQ (V)5.50
最高工作电压 (V)5.50
最低工作温度 (°C)-40
Min. Operating VCCQ (V)4.50
最低工作电压 (V)4.50
组织 (X x Y)128K x 8
Part FamilyAsync Micropower (MoBL) SRAMs
速率 (ns)45
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.40 $2.03 $1.81 $1.58 $1.50 $1.42
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
32
Package Dimensions
315 L x 1 H x 787 W (Mils)
Package Weight
375.63 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
112
HTS Code
8542.32.0041
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2016 年 9 月 21 日

技术文档

应用笔记 (2)

产品变更通知 (PCN) (8)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 06 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 32 lead TSOP 8x20mm Pb-Free package
2018 年 5 月 28 日
Correction to PCN#071512: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (6)

2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2020 年 4 月 14 日
Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels

白皮书 (1)

2016 年 4 月 12 日

IBIS (1)

2009 年 9 月 02 日

VHDL (1)

2009 年 9 月 02 日